The Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) is a biannual event. The next edition will be held from 12 - 14 September 2023, Belgium.
It is the purpose of the UCPSS symposium to increase the level of understanding on ultra-clean processing and surface preparation technology in all steps of the fabrication of ICs, bioelectronics devices and PV-modules. The conference consists of invited presentations, as well as selected contributing presentations and posters.
The topics to be addressed include, but are not limited to:
· Fundamentals of contaminants on surfaces and contamination-substrate interactions.
· Removal of contaminants in all steps of micro-, nano-electronics applications and 3D-integration.
· Surface chemistry, passivation, conditioning and characterization of group IV and III/V materials (Si, Ge, SiGe, SiC, InP, GaAs and InGaAs) for sensitive FEOL processes (high-k-metal gate stacks dielectrics, Ge surfaces, III-V, CVD and MBE- epitaxy, ALD, SAM deposition).
· Post-CMP clean for advanced Logic, Memory and 3D-applications.
· Cleaning and advanced etching schemes in advanced RMG and work function tuning.
· Surface processing in high-aspect ratio trenches and vias.
· Surface processing and drying of flexible and fragile high aspect ratio topography: leaning, sticking, collapse.
· Chemical and physical cleaning in liquid, gaseous, vapour, remote plasma and supercritical fluids (e.g. scCO2).
· Cleaning and surface preparation for novel materials for Qubits (quantum computing) and advanced memory applications (DRAM, Flash memory, PCM, RRAM, MRAM, STT, ...:): magnetic materials, OTS-materials, topological insulators,…
· BEOL strip and cleans, including corrosion issues of aggressively scaled interconnect schemes
· Trade-offs between cleaning performance, substrate damage and etching.
· Contamination/particle control and its relation with process yield or performance.
· Importance of ambient control during fabrication, transport or storage for wafer surface cleanliness.
· Yield enhancement cleans: wafer backside, bevel.
· Removal of (modified) photo resist, post etch residues and polymers.
· Analytical methods, process and contamination diagnostics, in-situ monitoring and process control.
· General issues in ultra-clean technology, ultra-pure materials and supply systems.
· Safety, environmentally friendly technologies and mass balance equations.
· Challenges of cleaning EUV-masks.
· Transfer, cleaning and surface preparation of 2D-materials (graphene, WS2, MoS2, WSe2, ...).
· Surface functionalization, e.g. based on SAMs or other methods.
· Surfaces for integrated bio-electronic sensors.
· Surface preparation and functionalization for integrated microfluidic bio-sensor devices:
including immobilization of bio-molecules on sensor substrates.
· Cleaning and surface preparation for photovoltaic applications, M- and N-EMS.