Detailed symposium programme and tutorial programme now available

UCPSS 2014 eSpace launched

Pre-registration deadline : 15 September

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The International Symposium on Ultra Clean Processing of Semiconductor Surfaces (UCPSS) is a biannual event. The past edition was held from 21-24 September 2014 in Brussels, Belgium.  

 

Sunday

21 September

Monday

22 September

Tuesday

23 September

Wednesday

24 September

 

Welcome & opening

 

Session 1A: FEOL

Session 2:

Metal etching for S/D contacts

Session 3:

Wet processing of high aspect ratio structures

Session 7:

3D

Session 8:

Photo voltaic cells

Poster announcement session PV

Coffee break

Coffee break

Coffee break

Poster

announcement session

Session  4:

Fluid dynamics, mechanics

Session 8:

Photo voltaic cells

(continued)

Registration open

Lunch

Poster viewing

Lunch

Poster viewing

Lunch

Poster viewing

 

Tutorials

 

Session 1B:

FEOL: III-V

Session 5:

Photo resist performance and rework

Session 6:

BEOL interconnects

Session 9:

Contamination control: AMC

Coffee break

Coffee break

Coffee break

Session 1C:

FEOL Etching of IV-semiconductors

Session 1D:

FEOL SI3N4 Etching

 

Session 6:

BEOL interconnects

(continued)

 

 

Student award

Closure

 

Exhibitor reception

Conference dinner

 

 

It is the purpose of the UCPSS symposium to increase the level of understanding on ultra-clean processing technology in all steps of the IC-production, PV manufacturing and bioelectronics. The conference consists of invited presentations, as well as selected contributed presentations and posters.

The issues to be addressed include, but are not limited to, the following topics:

  • Removal of contaminants in all steps of micro-, nano-electronics applications and 3D-integration
  • Fundamentals of contaminants on surfaces: e.g. particle-substrate interactions
  • Surface chemistry, passivation, conditioning and characterization of group IV and III/V materials (Si, SiGe, Ge, InP, GaAs and InGaAs) for sensitive FEOL  processes (post-CMP, high-k-metal gate stacks dielectrics, Ge surfaces, III-V, epitaxy, ALD)
  • Post-CMP clean for advanced Logic, Memory and 3D-applications
  • Cleaning and advanced etching schemes in advanced RMG and work function tuning
  • Cleaning and surface preparation for advanced memory applications (DRAM, Flash memory, PCM, RRAM, MRAM, STT, ...)
  • Chemical and physical cleaning in liquid, gaseous, vapour, remote plasma and supercritical fluids
  • Surface energy driven scaling limitations: wetting, sticking, collapse and drying
  • BEOL strip and cleans, including corrosion issues of aggressively scaled interconnect schemes
  • Trade-offs between cleaning performance, substrate damage and etching
  • Contamination/particle control and its relation with process yield or performance
  • Importance of ambient control during fabrication, transport or storage for wafer surface quality
  • Yield enhancement cleans: wafer backside, bevel
  • Removal of (modified) photo resist, post etch residues and polymers
  • Analytical methods, process and contamination diagnostics, in-situ monitoring and process control
  • General issues in ultra-clean technology, ultra-pure materials and supply systems
  • Safety, environmentally friendly technologies and mass balance equations
  • Challenges of cleaning advanced EUV-masks
  • Surface preparation for 2D-materials (graphene, MoS2, WSe2, ...) and clean transfer
  • Surface functionalization eg. based on SAM or other methods
  • Surface functionalization for integrated bio-electronic sensors
  • Cleaning and surface preparation for photovoltaic applications, M-and N-EMS

Click here to download the above group picture.

Click here for a short movie about UCPSS 2014.